LOSSNA-BOARD
Multifunctional heat insulation board with superior characteristics
The insulation must be required for insulation, and there is still a "heat" and "pressure" durability that corresponds to the long termLossna-board not only can be used to control the deformation due to the expansion of heat or pressure at high temperature, but also to control the permanent deformation caused by the long-term continuous use.In today 's high - precision industry, high temperature, high - precision forming machine insulation board and heat insulation material, high strength performance can be widely used in various fields
◆Thermal insulation board for semiconductor sealing die
◆Heat insulation plate for induction heating furnace
properties of matter | treatment conditions | unit | LOSSNA-BOARD |
thermostability |
|
| ℃ | 400 |
density |
| A | － | 2.00 |
| Water absorption ratio |
| A | ％ | 0.05 |
| normal atmospheric temperature; | A |
| 145 |
bending strength | Heating time | 200℃ | MPa | 140 |
|
| 400℃ |
| 135 |
compressive | normal atmospheric temperature | A | MPa | 439 |
|
| 200℃ |
| 430 |
| Heating time | 250℃ |
| 420 |
|
| 400℃ |
| 415 |
压缩歪斜率200℃ /14.7MPa | 100 hr |
| 0.1 |
| 400 hr | ％ | 0.2 |
| 700 hr |
| 0.25 |
Split strength |
| A | kN | 3.1 |
Rockwell硬度 |
| A | HRR | 124 |
Izod冲击强度 | vertical direction | A | J/cm | 2.9 |
热膨張系数 | vertical direction | RT～200℃ | 1／℃ | 2.6×10-5 |
thermal conductivity |
| A | W/mK | 0.24 |
Insulation resistance | normalcy | C-90/20/65 | MΩ | 1.0×108 |
| Boiled Buddha | C-90/20/65+D-2/100 |
| 2.0×103 |
Resistance to deformation of the arch |
| A | SEC | 345 |
※Test Method in accordance with JIS k-6911 (hot hardening resin general test method)。
※The numerical value is an example of a standard value, not a guaranteed value。